VIA Technologies & S3 Graphics news

Intel, AMD, VIA, IBM, ...

Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » sob 04. čer 2016 16:21:59

Dota 2 || VIA QuadCore E C4650 2.0GHz

"The VIA Nano processor was designed to bring power efficiency and performance to everyone, with no compromises"
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » ned 12. čer 2016 11:36:58

VIA Alliance Semiconductor Co Ltd
VIA's* ZX-D CPUs coming first to high-end servers at 2018
source: semi.cena.com.cn

* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pon 13. čer 2016 18:18:13

Old news but OK...

Lenovo sta studiando soluzioni basate sulle CPU quad core ZX-C di VIA
source: www.bitsandchips.it
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pon 13. čer 2016 21:20:09

VIA* CND001 ND001EB1_7BMB
VIA ZX-100S chipset

• Dual Channel DDR3 memory (up to 64GB)
• 256 stream processors iGPU powered by S3 Graphics IP technology and ready for VR
• PCI-E 3.0
• SATA 3.0
• USB 3.0


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source image: Loeschzwerg from http://www.forum-3dcenter.org/

* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd
"The VIA Nano processor was designed to bring power efficiency and performance to everyone, with no compromises"
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 16. čer 2016 12:29:41

VIA's* hardware: QuadCore / OctaCore / new chipset

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source: www.toutiao.com

* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 16. čer 2016 15:27:33

[PATCH, i386][Updated] Add native support for VIA C7, Eden and Nano CPUs

J. Mayer Thu, 16 Jun 2016 02:13:04 -0700

The following patch adds support and native detection for C7, Eden
"Samuel2", Eden "Nehemiah", Eden "Esther", Eden x2, Eden x4, Nano 1xxx,
Nano 2xxx, Nano 3xxx, Nano x2 and Nano x4 VIA CPUs.

This patch has been updated against current repository.
It contains documentation and Changelog updates.

+@item eden-x4
+VIA Eden X4 CPU with x86-64, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1,
SSE4.2, AVX and AVX2 instruction set support.


source: https://www.mail-archive.com/gcc-patches@gcc.gnu.org/msg141434.html
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 24. čer 2016 23:48:00

VIA* CND001 ND001EB1_7BMB
VIA ZX-100S chipset

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* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 21. črc 2016 12:48:48

Taiwan’s VIA Technologies Buys Controlling Stake in Third-Party Payment Processor Neweb
source: www.technews.co
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 22. črc 2016 10:08:16

Shanghai Zhaoxin Semiconductor Co., Ltd. ZX8711A TBD
source: ranker.sisoftware.net
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 03. srp 2016 0:57:17

QuadCore vs OctaCore

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source: http://sucai.redocn.com/hangyebaitai_6625129.html

______________________________________________________________________________________________________

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source: http://cpu.it168.com/a2016/0802/2828/000002828959.shtml
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » ned 07. srp 2016 20:13:38

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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 09. srp 2016 23:30:26

Sneak peek
CPU-Z (VIA CNR processors) support coming soon

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source: http://valid.x86.fr/vgym33

Stay tuned...

P.S. I am proud to Loeschzwerg from forum-3dcenter.org. Good job!

____________
We support HWiNFO64 and now also CPU-Z and it is a great strength of the VIA community.
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 10. srp 2016 20:33:56

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VIA SSD Controllers with High-Performance Gear-Shifting Technology @ the 2016 Flash Memory Summit

Offer best-in-class error correction capability with over 3x longevity for TLC NAND Flash devices

Taipei, Taiwan, 10 August, 2016 – VIA Technologies, Inc, today announced that it be will demonstrating its latest VIA NVMe PCIe Gen III & SATA III SSD controllers in Booth#818 of the 2016 Flash Memory Summit being held from August 9th to 11th in the Santa Clara Convention Center, California, USA.

Featuring the VIA LDPC PLUS ECC decoding engine with Gear-Shifting technology, the second generation VIA SSD controllers offer best-in-class error correction capability and ensure high-throughput performance without overheating issues.

“VIA Gear-Shifting technology leverages our unique dual hardware decoding architecture to maximize data integrity and longevity,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “Our second generation VIA SSD controllers are the ideal choice for computing devices that require superior SSD performance with high cost-efficiency.”

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• Multiple 2D/3D MLC/TLC NAND flash support: Intel, Micron, Toshiba, Hynix, and SanDisk
• AES 128/256 data encryption / decryption acceleration
• VIA LDPC PLUS ECC decoding engine with Gear-Shifting technology
• 2-lane (4-channel) architecture with 40 LP process

For those attending this year’s FMS, be sure to register for the following talks being presented by VIA:

• High-Throughput LDPC Solution for Reliable and High Performance SSD
Forum E-21, Wednesday, August 10th, 8:30-10:50am

• SSD Flash Management for 3D NAND Flash Memory
Forum M022, Wednesday, August 10th, 3:50-6:15pm

• High Performance FTL Architecture for PCIe/NVMe SSDs
Session 302-D, Thursday, August 11th. 9:45-10-50am

For more information about VIA SSD Controllers, please visit: http://www.viatech.com/en/silicon/ssd-controllers/

For images related to this press release, please visit: http://www.viagallery.com/via-products/ ... ntrollers/

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For more information about the 2016 Flash Memory Summit, please visit: http://www.flashmemorysummit.com/

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. http://www.viatech.com

source: www.viatech.com
source: www.viatech.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 11. srp 2016 17:03:59

HWiNFO32 & HWiNFO64 v5.35, Build 2935 with the official logo VIA Eden X4

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source: Loeschzwerg from www.forum-3dcenter.org
Naposledy upravil Tralalák dne úte 16. srp 2016 17:22:53, celkově upraveno 1
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 16. srp 2016 17:18:33

SIV - System Information Viewer

Version 5.12 released on 14-Aug-2016

Added support for Windows 10 RS2 V10.00 Build 14901. Enabled operation of [ACPI HAL], [ACPI Buses], [ACPI Eval] and [ACPI Ports].
Improved NVMe Disk SMART reporting on Windows 10 systems and added Intel NVMe (IaNVMe service) support.
Added ASUS Gryphon Z87 + Gryphon Z97 + MSI MS-7885 motherboard support. Improved ASUS Z97 support.
Added VIA Eden X4 + QuadCore (Isaiah II, CNR) support.
Resolved issue with the SIV Tray Icon sometimes being missing when auto-run is used and after a shell restart.
Added Topmost support to LCD panels.
Added a hold-off delay before CoolIT (CL Mini, H110i, etc.) controlled fans will slow down and [Link Setup] to set this delay.
Allow for CL 4.2.4.25 using Global\CorsairLinkReadWriteGuardMutex rather than Global\Access_CorsairLink.
Corrected reporting of CreateFile() failures and improved reading of H115i + H100iV2 + H80iV2 cooler information.
Added initial AMD Zen support and corrected AMD Bulldozer to report as cores (modules) that have two logical processors (integer cores).

source: rh-software.com

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source: Loeschzwerg from www.forum-3dcenter.org

My computer
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 18. srp 2016 0:02:55

Shanghai Zhaoxin Semiconductor Co., Ltd. | VIA Alliance Semiconductor Co Ltd.
Zhaoxin shipped over one million TVOS set-top boxes with ZX-2000 SoC


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Zhaoxin ZX-2000 chip supports 4K @ 60FPS video decoding, integrated proprietary GPU, leading performance


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Zhaoxin intelligent set-top box shipments reached 100 million units (ZX-1000 + ZX-2000)

* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 18. srp 2016 19:32:13

VIA x86 processor 28nm Lineup:
• VIA QuadCore E C4650 2.0GHz 18 Watt TDP
• VIA Eden X4® C4450 1.6GHz (Boost up to 2.0GHz) 9 Watt TDP
• VIA Eden X4® C4250 1.2GHz (Boost up to 1.73GHz) 6 Watt TDP
• VIA Eden X1® C1050 1.06GHz 2 Watt TDP

source: Loeschzwerg from www.forum-3dcenter.org
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 19. srp 2016 22:23:17

New VIA New website design
source: www.viatech.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 02. zář 2016 10:40:35

Battlefield 1 Minimum PC (CPU) Requirements
source: https://forums.battlefield.com

• Processor (AMD): AMD FX-6350 3.9GHz @ TurboBoost 4.2GHz,
• Processor (Intel): Core i5 6600K 3.5GHz @ Turbo 3.9GHz,

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:zed:

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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 08. zář 2016 10:49:54

Shanghai Zhaoxin Semiconductor Co., Ltd. | VIA Alliance Semiconductor Co Ltd.
ZX-C processors and ZX-100S chipset

Zhaoxin ZX-C 4xxx processor is a new generation of quadcore processors, they are designed for high performance computing.

• four x86 CPU cores integrated on the single chip packaging;
• 64-bit Superscalar Speculative Out-of-Order Microarchitecture;
• High-performance Multi-Media Computation;
• New Virtual-Machine Architecture;
• Hardware security features (SM3 and SM4);
• 28nm CMOS fabrication process;
• Leadership in Performance per Watt;
• up to 2.0GHz (up to 18W TDP);
• 21mm x 21mm NanoBGA package;

Zhaoxin ZX-C + FC-1080 processor is a new generation of octacore processors, they are designed for high performance computing.
• eight x86 CPU cores integrated on the two single chip packaging dies;
• 64-bit Superscalar Speculative Out-of-Order Microarchitecture;
• High-performance Multi-Media Computation;
• New Virtual-Machine Architecture;
• Hardware security features (SM3 and SM4);
• 28nm CMOS fabrication process;
• Leadership in Performance per Watt;
• up to 2.0GHz;
• 21mm x 21mm NanoBGA package;

image source: pconline.com.cn

ZX-100S chipset (VIA* CND001 ND001EB1_7BMB) with an integrated ChromE-1000 graphics processor offers a world-class DirectX® 11.3 HD multimedia platform offers richer visual and 3D contents for graphics-intensive Desktop/Mobile/Embedded and Server applications.

• Dual Channel DDR3 memory (up to 64GB)
• 256 stream processors iGPU powered by S3 Graphics IP technology and ready for VR
• PCI-E 3.0
• SATA 3.0
• USB 3.0

* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd
Naposledy upravil Tralalák dne stř 14. zář 2016 9:05:11, celkově upraveno 1
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 14. zář 2016 9:03:29

Shanghai Zhaoxin Semiconductor Co., Ltd. | VIA Alliance Semiconductor Co Ltd.
Zhaoxin campus 2017

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image source: zhaoxin.zhiye.com

* Zhaoxin 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd

source: zhaoxin.zhiye.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 16. zář 2016 14:36:21

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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 22. zář 2016 15:56:59

ZHAOXIN Kaixian ZX-C C4600
source: www.club.kdnet.net
source: www.techweb.com.cn
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pon 26. zář 2016 13:07:14

Wuhan University launched a joint trillion core Domestic Universal trusted server solution
source: http://www.top-news.top/news-12399707.html
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pon 26. zář 2016 20:47:27

For a while we were extrahardware forum TOP class

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I still can not believe ...

I appreciate it and it is binding not only for me.
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