VIA Technologies & S3 Graphics news

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Příspěvekod Tralalák » úte 27. zář 2016 9:46:52

VIA ARTiGO A830 Powers Streetwise IoT Innovation

Customizable Android system accelerates development of smart O2O (online-to-offline) applications and services in urban environments

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Taipei, Taiwan, 20 September, 2016 – VIA Technologies, Inc. today unveiled its new VIA ARTiGO A830 system for streetwise IoT deployments, including smart lockers, smart vending machines, and smart information kiosks and signage.

With its ruggedized enclosure, wide operating temperature range of -20°C ~ 60°C, and surge and lightning protection, the system has been designed to deliver 24/7 reliability in even the most demanding outdoor environments. High-performance compute, graphics and video features guarantee optimum performance for intensive multimedia shopping, entertainment, and navigation applications, while the integrated 5W audio amplifier ensures optimum audio quality.

“The VIA ARTiGO A830 provides a scalable interactive hub for businesses and government departments to deliver a host of innovative logistics, retail, and smart city services direct from the streetside,” commented Richard Brown, VP of International Marketing for VIA Technologies, Inc. “With its highly-flexible design, the system can be customized for multiple applications and business models – whether it’s a smart vending machine for hot or cold meals or a smart locker for package pickup and deliveries.”

VIA ARTiGO A830

The VIA ARTiGO A830 combines an ultra-reliable, high-performance system hardware platform with a stable Android 4.4.2 software framework that enables the rapid development of multimedia-rich applications and services using touch, voice, and wireless interfaces. It is already being deployed in cities throughout China, where high smart phone usage rates and the proliferation of mobile payment systems are driving the development of O2O (online-to-offline) applications and services among dense urban populations.

Key features include:

Rich I/O: including six USB 2.0 ports, five RS-232 COM ports, one 3-pole Phoenix RS-485 COM port, one Gigabit Ethernet port, and one SIM card slot that support a wide variety of peripherals such as touch screens, barcode scanners and readers, and security cameras.
Advanced video and audio performance: including HDMI and LVDS support for high-definition video and an integrated 5W audio amplifier for high-quality audio output.
-20 ~ 60℃ wide operating temperature: ensures stable operation in harsh climate conditions.
Anti-static and lightning: provides resistance to various external shocks for uninterrupted 24/7 operation
Android BSP Development Kit: enables full support for customers-specific requirements from application design and software development to remote monitoring & maintenance – greatly speeding up the development process and time to market.

For more information about the VIA ARTiGO A830, please visit: http://www.viatech.com/en/systems/small ... tigo-a830/

For images related to this release, please visit: http://www.viagallery.com/via-products/ ... tigo-a830/

source: www.viatech.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 28. zář 2016 12:33:38

OpenChrome Maintainer Making Some Progress On VIA DRM Driver
source: www.phoronix.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 29. zář 2016 22:49:00

tmpgenc authoring works 5: AVX vs AVX2
VIA Eden x4の性能とは?
source: http://www5b.biglobe.ne.jp/~pika2/via.html
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » ned 02. říj 2016 21:21:18

Zhaoxin & Wuhan University server solution
source: www.ccidcom.com
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Příspěvekod Tralalák » čtv 06. říj 2016 13:10:20

VIA Announces First USB 3.1 to SATA Single-chip Bridge with USB-IF Certification

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The world’s first single-chip native USB-C™ to SATA solution to achieve USB-IF certification

Taipei, Taiwan, 5 October, 2016 – VIA Labs, Inc., a leading supplier of SuperSpeed USB and Power Delivery Controllers, today announced that the VIA Labs VL716 USB 3.1 to SATA III Bridge Controller with native USB Type-C™ support has achieved SuperSpeed USB 10 Gbps certification from the USB Implementers Forum (USB-IF).

Optimized for the latest USB Type-C™ external storage applications such as USB Type-C™ optical drives, SSD’s, and HDD’s, the VL716 single-chip USB 3.1 Gen 2 to SATA III Bridge Controller offers blazing data transfer rates up to 10Gbps and is fully backwards compatible with USB 3.1 Gen 1, USB High-Speed, and USB Full-Speed modes. With native USB Type-C™ support built-in, the VL716 offers advanced features such as USB-C™ connector orientation detection and USB Mux to enable the reversibility feature without additional components or cost.

“Integrating SuperSpeed USB 10 Gbps and USB Type-C™ support minimizes the need for multiple components and reduces cost for developers,” said Jeff Ravencraft, USB-IF President and COO. “Companies like VIA Labs are growing the USB ecosystem by developing compliant solutions and submitting products for USB-IF compliance testing.”

“SuperSpeed USB 10 Gbps and USB Type-C™ certification is an industry first that places us well ahead of the USB 3.1 pack,” said Wayne Chang, Product Manager of Sales at VIA Labs, Inc. “This quality certification combined with the market’s broadest USB 3.1 product range, spanning host, hub and device controllers, will assure our customers that we truly have the know-how to drive SuperSpeed USB 10 Gbps into the mainstream.”

VIA Labs VL716 / VL715

In addition to the 10Gbps data transfer rate, the VL716 also integrates all of the expected features of a high performance, BOM-optimized, low power USB to SATA Bridge Controller such as integrated 5V to 3.3V Linear Regulators and 5V to 1.2V Switching Regulators. The VL716 is designed to fit small form-factor design, featuring the easy-to-manufacture 6x6mm QFN 48L green package and is also fully compatible with any modern operating system with USB storage support including Windows®, Mac OSX (Mac OS™), Linux, and Android.

If native USB Type-C™ support is not needed, VIA Labs also offers the VL715, a USB-IF Certified USB 3.1 Gen 2 to SATA 6Gb/s bridge controller for legacy USB micro-B connectors.

For more information about the VIA Labs VL716 or to purchase an evaluation board, please visit: http://www.via-labs.com/shop.php?id=4

The VIA Labs VL716 / VL715 SATA bridge controllers are currently shipping. For information on pricing, please contact your local VIA Labs sales representative or send an email to: sales@via-labs.com

For images related to this release please visit: http://www.viagallery.com/via-products/ ... /via-vl716

About VIA Labs, Inc.

VIA Labs, Inc. is a leading supplier of SuperSpeed USB and Power Delivery Controllers, based on the latest USB-IF Standards. As the world’s first company to offer a complete USB 3.1 product portfolio including Host, Hub, and Device Controllers, VIA Labs, Inc. has demonstrated technology and industry leadership through Standards Development and bringing newly developed USB Technologies to market. In addition to USB Host, Hub, and Device Controllers, VIA Labs, Inc. core product lines include new USB Type-C™, Power Delivery, and Charging IC’s. VIA Labs, Inc. is a wholly owned subsidiary of VIA Technologies, Inc. http://www.via-labs.com

source: www.viatech.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 11. říj 2016 23:00:32

ZHAOXIN KaiXian ZX-C+ C4701@2.0GHz (4C 2GHz, 2MB L2)
source: ranker.sisoftware.net
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 12. říj 2016 15:09:08

Core Temp 1.4

Version 1.4 - 11th October, 2016
• Fix: Dual and quad core VIA CPU support. Corrected VID detection for newer Nano processors and added support for 28nm CPUs.

source: www.alcpu.com

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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » ned 16. říj 2016 21:25:45

ZX-C, ZX-C+, ZX-D, ZX-E processors and ZX-100S chipset
16nm x86 WUDAOKOU SoC (2018): ZHAOXIN*


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source: http://dy.163.com/v2/article/detail/C3B222HJ0511A3C8.html

* ZHAOXIN 上海兆芯集成电路有限公司 | VIA Alliance Semiconductor Co Ltd

____________________________________

* In 2003, VIA settled its long-time patent and monopolisation disputes against Intel in the UK in exchange for an extensive cross-licence agreement with Intel for 10 years.
source: http://ec.europa.eu/competition/sectors/ICT/intel_provisional_decision.pdf

* In addition, the FTC settlement order will require Intel to:

modify its intellectual property agreements with AMD, Nvidia, and VIA so that those companies have more freedom to consider mergers or joint ventures with other companies, without the threat of being sued by Intel for patent infringement;
offer to extend VIA’s x86 licensing agreement for five years beyond the current agreement, which expires in 2013;
source: https://www.ftc.gov/news-events/press-releases/2010/08/ftc-settles-charges-anticompetitive-conduct-against-intel

______
About VIA Alliance Semiconductor Co Ltd. - 上海兆芯集成电路有限公司 (ZHAOXIN)

VIA Alliance Semiconductor Co., Ltd. was established in April 2013 with a total registered capital of USD$250M. As a joint venture between Shanghai Alliance Investment Ltd. who is affiliated to Shanghai SASAC and VIA Technologies, Inc., VIA Alliance Semiconductor Co., Ltd. has about 1000 employees and locates its headquarter at Zhangjiang of Shanghai with branches in Beijing, Hangzhou, Wuhan, Shenzhen, Taiwan, California and Texas of America.

With the forefront technologies and know-how in the design of CPU, GPU and chipsets, VIA Alliance Semiconductor Co., Ltd. is well known to provide high security, high performance, low power dissipation, and low cost SoC solutions.

As a fabless SoC factory, VIA Alliance Semiconductor Co., Ltd. adopts advanced 40nm and 28nm semiconductor processes. VIA Alliance Semiconductor Co., Ltd.’s main products include CPU and chipsets for desktop PC and laptop and ARM Cortex series SoC with its state of the art Elite series GPU and Video Engine IPs. VIA Alliance Semiconductor Co., Ltd. aims at becoming the leading SoC solution supplier for smart TV (TVOS), smart phone and tablets.


source: http://en.zhaoxin.com/site/introduction
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 18. říj 2016 19:09:06

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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » sob 29. říj 2016 9:08:50

New toy for Nano Personal Gaming Console Platform Project

144.78mm EVGA GeForce GTX 1050 Ti SC GAMING (Base Clock: 1354 MHz
Boost Clock: 1468 MHz)



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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » ned 30. říj 2016 22:47:39

Lenovo Zhaoyang CF03 notebook and biens Mini-PC by the Shanghai Electronic Information Technology Co., Ltd.
Practical experience with ZHAOXIN KaiXian ZX-C C4600 2.0GHz

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source: http://www.wanhuajing.com/

P.S. A good try...
Spoiler: zobrazit
V4 bus 1333MHz
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V4 bus 1066MHz
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 02. lis 2016 11:39:32

HOT NEWS

Zhaoxin ZX-D @2000MHz (8C 2GHz, 4MB L2)
source: ranker.sisoftware.net

CentaurHauls Family 6 Model 31 Stepping 12
New 16nm ZHAOXIN ZX-D @ 800 MHz tested
source: browser.primatelabs.com

___________
Other news about Zhaoxin ZX-C

China - made quad - core X86 processor production alternative AMD / Intel
source: www.cnbeta.com

ZX-C processor won the gold medal of China International Industry Fair
source: www.cctime.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 04. lis 2016 0:56:57

VIA QuadCore E C4650 2.0GHz, EVGA GeForce GTX 1050 Ti OC Gaming 4GB GDDR5, 16GB DDR3 1333MHz, Win 10 x64 v1607, GeForce 375.70

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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » stř 16. lis 2016 3:15:55

Lenovo M6100 with Zhaoxin ZX-4600 2.0GHz review
source: http://digital.pconline.com.cn/855/8557762.html
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 17. lis 2016 12:39:57

VIA @ China Hi-Tech Fair (CHTF 2016)
source: info.shuma.hc360.com/
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pát 18. lis 2016 16:40:08

VIA Alliance Semiconductor Co Ltd. - 上海兆芯集成电路有限公司 (ZHAOXIN)
Zhaoxin ZX-C+ OctaCore for VR (CHTF 2016)
source: www.cctime.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 24. lis 2016 14:03:57

VIA Alliance Semiconductor Co Ltd. - 上海兆芯集成电路有限公司 (ZHAOXIN)
Lenovo & Tsinghua Tong Fang Chaoxiang AiO PCs with ZX-C C4600 2.0GHz
source: mini.eastday.com


_________________


Zhaoxin booth @ China International Industry Fair 2016
source: cpu.yesky.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pon 26. pro 2016 23:19:13

2017: 28nm ZX-C and 16nm ZX-D procesors
source: www.eefocus.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 29. pro 2016 16:41:48

CentaurHauls Family 6 Model 31 Stepping 12
Zhaoxin ZX-D @2000MHz (8C 2GHz, 4MB L2)
source: ranker.sisoftware.net

SiSoftware Sandra 22.20 - Windows x64 7.0.1 - Processor Multi-Media
• Zhaoxin ZX-D @2000MHz (8C 2GHz, 4MB L2): 83.51Mpix/s
• Intel Core i7-920XM Processor Extreme Edition (4C/8T 2.13GHz/3.19GHz, 4x 256kB L2, 8MB L3): 77.86Mpix/s

source: ranker.sisoftware.net
source: ranker.sisoftware.net
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 03. led 2017 1:25:43

VIA Mobile360 Surround View System

Fanless ultra-compact in-vehicle 360° surround view surveillance system

The VIA Mobile360 In-Vehicle Surround View Fleet Management System is a 360° real-time video monitoring and recording systems for commercial transportation applications. The system delivers real-time in-vehicle recording for up to eight individual HD camera streams. Utilizing VIA Multi-Stitch technology, the system can seamlessly combine up to six camera feeds on the fly to create an encompassing real-time spherical view of a vehicle’s surroundings that can be viewed locally or remotely.

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Features and Specifications

„ High-performance 1.8GHz Cortex-A17 / 1.4GHz Cortex-A7 big.Little octa-core SoC

„ 2GB Mobile LPDDR3 1600MHz RAM (Package-on-Package with SoC)

„ 3 integrated, independent 2D/3D and video processing units Graphics engine supporting OpenGL® ES 3.1 hardware acceleration Supports MPEG-2, VC1, H.264 and H.265 video decoding up to 3840x2160 @ p30
Supports H.264 and H.265 encoding

„• 16GB eMMC Flash memory

Local recording and storage

„ One internal SATA bay for 2.5" SSD

„ 8 FARKA connectors for camera-in

„• 360° real-time display with VIA Multi-Stitch technology

„ 9-36V DC-in with ACC/IGN support

„• CAN Bus support

Ruggedized design with extended temperature



source: forum.cnews.cz


VIA Mobile360 SVSS IMAGES
Spoiler: zobrazit
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source: www.viatech.com
source: VIA_Mobile360_SVS_datasheet_v161207.pdf
source: www.viagallery.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » pon 16. led 2017 13:25:01

非凡新聞實測新一代Mobile360環景車載系統

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source: www.viatech.com/tw
source: www.viatech.com/tw
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 17. led 2017 11:07:14

Shanghai Zhaoxin Semiconductor Co., Ltd. HX001EB1 TBD
Zhaoxin ZX-C860 iGPU

• Zhaoxin ZX-D (8C 1.8GHz ~ 2.0GHz, 4MB L2)
• DIMM DDR3 (2.4GHz) PC3-19200

source: ranker.sisoftware.net
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 09. úno 2017 14:16:31

VIA Zhaoxin Semiconductor Co. Ltd.
New Zhaoxin web site
Source: http://www.zhaoxin.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » úte 14. úno 2017 16:28:26

Zhaoxin 웹사이트에 공개된 VIA 8CORE 프로세서와 칩셋 정보
S3 Graphics/VIA소식 2017.02.09 22:09

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VIA Technology의 중국 지사라고도 할 수 있는 상해조심(Shanghai Zhaoxin) 웹사이트에 VIA의 8코어 프로세서인 ZX-C+ FC1080/1081과 ZX-100S 칩셋의 스펙이 업로드 되었습니다.

이전에 작성한 게시물과 내용은 큰 차이가 없습니다.

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1. ZX-C+ FC1080/1081 (http://www.zhaoxin.com/ZXC.aspx?seriesid=5)

요약 : 8C8T, 28nm, TDP35W, FSB1333MHz, 2.0Ghz, SSE4.2/AVX/AVX2, 4MB Cache(L2?), FCBGA(nanoBGA?)

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2. ZX-100S (http://www.zhaoxin.com/ZXC.aspx?seriesid=6)

요약 : PCIE3.0(19LANE), SATA3.0(PCIE LANE 공유), USB3.0, DDR3(SODIMM/UDIMM), Dual Channel, iGPU(DP/HDMI/DVP(DVI?)/VGA 지원), TDP13~15.5W(12~14.5?)

IGP에 관한 내용이 있으나 출력포트 지원 이야기만 있고 어떤 칩셋이 사용되었는지와 사양(SPEC)에 관한 이야기가 없습니다. 정보 요청합니다. S3 Graphics 사용하고 싶습니다.

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3. Block Diagram (http://www.zhaoxin.com/Upload/201701111747560596.pdf)

결론 : 어디서 구매 가능합니까?

source: savage3d.tistory.com/
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 23. úno 2017 14:17:42

VIA Launches VIA SOM-6X50 IoT Acceleration Platform for Automated Ticketing, Signage, and Kiosk Devices

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Taipei, Taiwan, February 23, 2017 – VIA Technologies, Inc., today announced the launch of the new VIA SOM-6X50 IoT Acceleration Platform for the rapid development of automated ticketing, signage, and kiosk devices.

“Self-service systems that let consumers access information or purchase items with a tap on the screen or through their smart phone are critical for improving the user experience no matter whether it’s at a retail store or a parking lot,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “With our latest VIA SOM-6X50 IoT Acceleration Platform, we make it fast and easy for operators to design and build automated information display and transaction processing systems that meet their exact deployment needs.”

The VIA SOM-6X50 is an ultra-compact system-on-module that measures a mere 6.76cm x 4.3cm. Powered by a 1.0GHz VIA Cortex-A9 SoC, it delivers the perfect balance of performance and rich multimedia features in a highly-flexible package for a wide range of IoT automation and HMI applications.

I/O and display expansion options include two USB 2.0 ports, one USB 2.0 device port, one HDMI port, one single-channel 18/24-bit LVDS panel, six UART, one CSI camera input, 10/100Mbps Ethernet, eleven GPIO and one SD Card slot. The VIA SOMDB1 carrier board multi-I/O evaluation carrier board is available. A custom baseboard can be also be developed meet specific requirements.

The VIA SOM-6X50 features a Linux BSP which includes the kernel (3.4.5) and bootloader source codes. Other features include a Tool Chain to help adjust the kernel and to support the VIA SOMDB1 carrier board I/O and other hardware features.

The VIA SOM-6X50 IoT Acceleration Platform will be on display at the VIA booth at the 2017 Embedded World Exhibition and Conference being held this March 14-16 in Nuremberg, Germany. The booth is located #2-551 in Hall 2 of the Nuremberg Exhibition Center. Other highlights include a broad spectrum of commercial-grade systems, HMI starter kits, and IoT acceleration platforms that can be rapidly customized for in-vehicle and in-station applications.

For more information about the VIA SOM-6X50, please visit: https://www.viatech.com/en/boards/modules/som-6×50/

For more information about VIA at Embedded World 2017, please visit: https://www.viatech.com/en/embedded-world-2017

For more information about VIA Custom IoT Design Services, please visit: http://www.viatech.com/en/services/hw-e ... om-design/

For images related to this release, please visit: http://www.viagallery.com/som-6×50/

source: www.viatech.com
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