VIA Technologies & S3 Graphics news

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Příspěvekod Tralalák » stř 08. bře 2017 15:23:30

Pattern that 8 core x86 CPU that draws the flow of Centaur from VIA appeared in China
source: pc.watch.impress.co.jp
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » ned 12. bře 2017 20:31:55

VIA x86 procesors still live as e.g. fanless 1.06GHz VIA Eden® X1 processor @ 2W TDP
VIA VB9001 3.5″ SBC coming soon

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source: www.viatech.com

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Stay tuned...

Experience a Smarter World @ Embedded World 2017
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Embedded World 2017
Nuremberg, Germany
Mar. 14-16, 2017
Booth# 2-551 Hall 2
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Příspěvekod Tralalák » čtv 16. bře 2017 0:19:21

Zhaoxin to roll out 16nm CPU in 2018
source: www.digitimes.com
source: www.digitimes.com.tw
_______
source: company.cnstock.com

• (2017): ZX-D (28nm)
• (2018): ZX-E (16nm)
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Příspěvekod Tralalák » čtv 16. bře 2017 22:30:04

VIA booth @ Embedded World 2017


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source: Tralalák at Embedded World 2017
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Příspěvekod Tralalák » pát 17. bře 2017 9:07:01

• 28nm Zhaoxin ZX-D processor series with memory controller DDR4 and iGPU in 2017

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source: www.zhaoxin.com



• 16nm 8-core 3.0GHz ZX-E processor series in 2018
source: www.digitimes.com
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Příspěvekod Tralalák » pát 17. bře 2017 22:18:51

Zhaoxin 2.0GHz ZX-D (28nm) & 3.0GHz ZX-E (16nm) benchmarked!

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source: www.kejixun.com


Zhaoxin processor roadmap

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source: www.kejixun.com
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Příspěvekod Tralalák » úte 21. bře 2017 2:45:48

Bude po comebacku AMD i návrat procesorů VIA? Chystá FinFETové čipy a velkou modernizaci
Od Jan Olšan - 21.3.2017
source: www.cnews.cz
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Příspěvekod Tralalák » stř 22. bře 2017 13:48:17

VIA Launches Vpai 720-Degree Video Camera Platform

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Seven stylish models from leading China manufacturers enable consumers to enjoy compelling new visual experiences on the fly using their smart phones

Taipei, Taiwan, March 22, 2017 – VIA Technologies, Inc., today announced the launch of the first generation of Vpai 720-degree cameras in China. The devices can be ordered online in China for prices of less than US$100.

Available in a choice of stylish ultra-portable form factors, the seven models enable consumers to easily capture, view, and share their experiences in stunning panoramic image and video formats. The user-friendly Vpai app combined with Wi-Fi and USB connectivity options makes operating the cameras a snap in any environment, whether at a dinner with friends or out on the hiking trail.

“With the Vpai platform, VIA is working with leading manufacturers in Shenzhen to co-create innovative new products that enable consumers to enjoy and share compelling new visual experiences through their smart phones,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “By combining our advanced graphics and video technology expertise with the rapid product development and manufacturing capabilities of our partners, we are committed to accelerating the development of ground-breaking devices and applications for delivering rich and immersive content.”
Vpai Platform

Vpai combines a production-ready 720-degree camera hardware platform with a suite of user-friendly smart phone apps that enable high-resolution immersive video and image stitching on the fly.

The Vpai hardware platform features a high-performance silicon video compression engine that ensures instant full HD image quality without the need for post-processing, as well as dual fisheye lenses with transverse 360° and longitudinal 360° capture that ensure the generation of full-angle (2048×1024) immersive video and images.

Vpai software apps are available in Android, iPhone, and Windows formats, and with their user-friendly interface and flexible Wi-Fi and USB connectivity options make it easy to manage the cameras using a smart phone or PC.

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The apps come with a rich array of real-time immersive video and image capture, composition, and sharing features, including a choice of Panorama (spherical), Asteroid (outside-looking-in), and Fish-Eye (inside-looking-out) views. Online content sharing is facilitated by automatic connections to leading social media applications, including WeChat, Facebook, Twitter, and YouTube.

Chiptrip V71

The Chiptrip V71 is an easy-to-use 720-degree camera with a mini-tripod that makes it ideal for shooting high-quality spherical video and images from flat surfaces such as tables and desks. All industry-standard tripods can also be attached using the screw-in connector. This stylish and compact device comes with a built-in microphone for recording high-quality audio, a Micro SD slot that is compatible with cards of capacities of up to 64GB, and a 900mAh lithium ion battery that supports up to forty minutes of recording time. With its integrated Wi-Fi and a Micro USB 2.0 port, the camera can be easily connected to a smart phone or PC. A choice of Android and iPhone apps are available.

Chiptrip V72

The palm-sized Chiptrip V72 combines a distinctive spherical design with an integrated 1200mAh battery that delivers up to seventy minutes of recording time to provide a fun and friendly camera for capturing and sharing high-resolution 720-degree video and image content. To ensure seamless connectivity to a smart phone or PC, the camera comes with integrated Wi-Fi and a Micro USB 2.0 port. A choice of Android and iPhone apps are available. Other features include a built-in microphone, a Micro SD slot supporting cards of capacities of up to 64GB, and a mini-tripod.

Chiptrip V73

Sporting an eye-catching, ultra-light design, the Chiptrip V73 provides the fastest and most convenient way to shoot 720-degree videos and images on the fly. It can be instantly plugged into an Android smart phone using its USB Type-C/Micro USB 2.0 connector to capture and share magical immersive moments anytime and anywhere.

ForFun V1

The ForFun V1 is a user-friendly point-and-shoot camera that combines an attractive design with a wealth of features including an integrated 0.96” 128×64 OLED panel for viewing captured video and images, and a Micro SD slot that supports card capacities of up to 64GB. Built-in Wi-Fi and a Micro USB 2.0 slot enable seamless connectivity to Android smart phones and PCs.

ForFun VV720

The ForFun VV720 is a versatile 720-degree camera with a wealth of features, including a 900mAh lithium ion battery that supports up to forty minutes of recording time, a Micro SD slot that is compatible with cards of capacities of up to 64GB, a built-in microphone, and mini-tripod. The camera can be connected to an Android smart phone, iPhone or PC using its integrated Wi-Fi or Micro USB 2.0 port,

ForFun VV750

The ForFun VV750 provides the ultimate 720-degree camera for your Android smart phone with its USB Type-C/Micro USB 2.0 connector that enables you to capture images and video on the go. A variety of color options are available.

Eken Pano I

With its USB Type-C/Micro USB connector, the Eken Pano I can be inserted directly into an Android smart phone to shoot spherical video and image content wherever you happen to be. Available in a choice of striking color combinations, the camera is the perfect portable solution for filming in both indoor and outdoor environments.

Vpai cameras from Chiptrip, ForFun, and Eken are available for sale online in China at prices below US$100.

For more information about these models and the Vpai platform, please visit: http://www.720vpai.com/

For images related to this release, please visit: http://www.viagallery.com/720-vpai/

source: www.viatech.com
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Re: VIA Technologies & S3 Graphics news

Příspěvekod Tralalák » čtv 30. bře 2017 12:41:47

ZX-D: To by ready to takeoff

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source: www.eepw.com.cn
source: www.zhaoxin.com
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Příspěvekod Tralalák » pon 10. dub 2017 20:40:41

ZXD D4600@1800MHz (4C 1.8GHz, 4MB L2 & ZX C860 GPU)
source: ranker.sisoftware.net
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Příspěvekod Tralalák » stř 12. dub 2017 13:37:55

Zhaoxin to partner with TSMC
source: www.digitimes.com

Zhaoxin Dedicated to Developing x86 CPU's, to Partner with TSMC
source: www.hardocp.com

Zhaoxin fortifica la partnership con TSMC in vista delle CPU ZX-E @16nm
source: www.bitsandchips.it
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Příspěvekod Tralalák » pát 14. dub 2017 14:59:05

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Příspěvekod Tralalák » čtv 27. dub 2017 15:30:10

Zhaoxin ZX-D processor "Chinese core": performance can be comparable to Intel Core i5

source: www.laoyaoba.com (english google translate) and www.laoyaoba.com (slovak google translate) and [url][/url]
Naposledy upravil Tralalák dne pát 12. kvě 2017 11:22:34, celkově upraveno 1
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Příspěvekod Tralalák » pát 28. dub 2017 9:42:19

Zhaoxin ZX-D processors annunced at Beijing International Internet Technology Expo

source: www.eeworld.com.cn (english google translate)
Naposledy upravil Tralalák dne pát 12. kvě 2017 11:22:54, celkově upraveno 1
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Příspěvekod Tralalák » stř 10. kvě 2017 21:32:57

Zhaoxin ZX-D OctaCore with GeForce GTX 1070 in VR action HTC VIVE
source: www.ithome.com
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Příspěvekod Tralalák » pát 12. kvě 2017 11:24:57

Zhaoxin to lead the domestic CPU to a higher performance
source: www.eefocus.com
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Příspěvekod Tralalák » pon 05. čer 2017 12:40:56

ZXD D8600@2.0GHz (8C 2GHz, 4MB L2)
source: ranker.sisoftware.net
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Příspěvekod Tralalák » čtv 22. čer 2017 14:45:39

Press Releases
VIA Announces VIA Mobile360 Surround View Sample Kit

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Provides real-time in-vehicle 360° remote monitoring, recording, and tracking capabilities in a robust, highly-integrated solution with flexible customization options

Taipei, Taiwan, June 22, 2017 – VIA Technologies, Inc., today announced the launch of the VIA Mobile360 Surround View Sample Kit for real-time commercial 360° video vehicle monitoring, recording, and tracking applications.

The kit combines a ruggedized in-vehicle system featuring an integrated 4G modem and GPS for remote wireless tracking and monitoring with four automotive-grade FOV-190 cameras, and a 7” automotive-grade 720P P-Cap touch monitor with VESA mount support.

VIA Mobile360 System

With its ruggedized chassis, extended temperature support, and flexible voltage input, the VIA Mobile360 system has been specifically designed for the rigors of in-vehicle operation. Key features include:

• 1.8GHz Cortex-A17 / 1.4GHz Cortex-A7 big.LITTLE octa-core SoC
• 2GB Mobile LPDDR3 1600MHz RAM (Package-on-Package with SoC)
• Integrated 4G modem and GPS for remote wireless tracking and monitoring
• Support for up to six CSI/PoC cameras through six Farka connectors
• 512GB SSD (-40° – 90°) local storage
• Optional 7” HD resistive touch screen with VESA mount support
• 5+ years’ longevity with vitality support and locked BOM option
• Hardware and software customization options


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The VIA Mobile360 Surround View system harnesses VIA Multi-Stitch Technology to seamlessly combine the camera feeds on the fly and create an all-encompassing 360° view that can be displayed locally or remotely. It also features VIA Mobile360 E-Track, a cloud portal that enables fleet owners to collect and organize vehicle and driver data for real-time vehicle tracking, event and data recording, and asset management.

A variety of customization options are available to expand functionality through the integration of up to two additional FOV-190 or FOV-50 cameras. These include Enhanced Surround View for boosting 360° video capture and stitching capabilities on longer vehicles; Partial ADAS for the front/rear or right/left sides of the vehicle; and Computer Vision for extra E-Track capabilities such as driver monitoring, cargo monitoring, and license plate recognition.

“With its robust yet highly flexible design, the VIA Mobile360 Surround View Sample Kit can be deployed in commercial vehicles of all types and sizes – ranging from semis and delivery vans to excavation equipment and heavy machinery,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “By providing drivers with a comprehensive view of their immediate environment, the system helps not only to prevent accidents caused by blind spots but also to improve vehicle maneuverabilty in dense urban spaces and demanding terrains.”

Availability

The VIA Mobile360 Surround View Sample Kit is available now. For more information please visit: /solutions/smart-transportation/in-vehicle/mobile360-solutions/

For images related to this release, please visit: http://www.viagallery.com/mobile360-svs/

source: www.viatech.com
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Příspěvekod Tralalák » čtv 29. čer 2017 13:32:05

Android Signage Goes Ultra HD with Introduction of VIA ALTA DS 4K


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Enables retailers and restaurant operators to enhance customer engagement through stunning multimedia content and new interactive services

Taipei, Taiwan, 29 June, 2017 – VIA Technologies, Inc, today launched the VIA ALTA DS 4K Android commercial media player for stores, restaurants, coffee shops, and other retail locations.

With rich Ultra HD video and 3D graphics capabilities, smooth HTML5 rendering, and touch screen support, the VIA ALTA DS 4K provides the most versatile and affordable Android system for a host of high-impact customer engagement applications, including digital signage, automated kiosks, check-out counters, and POS systems. For added flexibility, the system also features Dual Ethernet connectors that enable the installation of an IP camera that can be configured to blend locally-captured real-time video streams with cloud-delivered content.

“With its ability to deliver dynamic location and time specific information in stunning multimedia formats, the VIA ALTA DS 4K is a powerful tool for capturing customer attention in any shopping and dining location,” commented Richard Brown, VP of Global Marketing, VIA Technologies, Inc.“Its scalable design provides the functionality and flexibility that retailers and restaurant operators need to develop innovative new services that boost customer convenience and increase sales.”

Rich Graphics and HD Video Performance

Powered by a 1.4GHz Cortex-A17 quad-core SoC, the VIA ALTA DS 4K combines high-performance 2D/3D graphics with an advanced video engine that supports Open® GL ES 3.0 hardware acceleration and H.265, H.264, VC-1, and MPEG-2 video decoding up to 3840 x 2160p @ 30fps. With dual hardware decoding of one Ultra HD and one Full HD video simultaneously and smooth HTML5 rendering, the system provides the ideal platform for digital signage displays where high-performance video and connectivity are paramount for enhanced customer engagement.
Hardware

The VIA ATLA DS 4K enables the connection of a wide array of peripheral devices with its rich set of I/O features that are integrated through the front and rear panels of its ultra-compact fanless chassis measuring just 175mm (W) x 25mm (H) x118mm (D). These include one USB 3.0 port, two USB 2.0 ports, one mini USB 2.0 port for COM (TX/RX), one SD Card slot, Line-out and Mic-in audio jacks, and one 1.4 HDMI port with CEC support, one CIR receiver as well as dual Ethernet ports (one GLAN and one LAN port).

Other features include 2GB DDR3 SDRAM and 8GB eMMC Flash memory. High-speed wireless networking capabilities can be added with the optional EMIO-5531 USB Wi-Fi & Bluetooth module.

VIA ALTA DS 4K Signage Solution Pack

Compatible with the latest Android Signage Content Management apps, the VIA ALTA DS 4K is available with a signage software solution pack which includes a highly customized Android 5.1.1 system image featuring the VIA Smart ETK which comprising a number of APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, WOL, RTC wake-up, UART access and a sample app. A full set of software customization services that speed up time to market and minimize development costs is also available.

For more information about the VIA ALTA DS 4K system please visit: https://www.viatech.com/en/systems/andr ... alta-ds-4k

For images related to this release, please visit: https://www.viagallery.com/alta-ds-4k

source: www.viatech.com
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Příspěvekod Tralalák » pon 24. črc 2017 16:45:27

ZX-E
Zhaoxin entwickelt x86-Chip mit 16-nm-Technik
source: www.golem.de


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source: www.zhaoxin.com
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Příspěvekod Tralalák » čtv 27. črc 2017 10:34:17

VIA ARTiGO A910 Small Form Factor PC coming soon

The VIA ARTiGO A910 will be powered by a 1.4GHz Cortex-A17 quad-core SoC (Zhaoxin ZX-2000M) with a high-performance 2D/3D graphics and video engine that supports OpenGL® ES 3.0 hardware acceleration for H.265, H.264, and VC-1 video decoding up to 3840 x 2160p @ 30fps.

source: https://browser.geekbench.com/geekbench3/8410238
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Příspěvekod Tralalák » úte 01. srp 2017 21:44:11

Asustek pays US$15 million to end lawsuits with VIA
source: www.digitimes.com
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Příspěvekod Tralalák » pon 18. zář 2017 15:51:32

SisoftSandra Ranker (SiSoftware Sandra 24.30 - Windows x64 10.0.17)
ZX-D D8600@2.0GHz (8C 2GHz, 2x 4MB L2)

Zhaoxin HX001EH0 1412 07 T8F1030

source: ranker.sisoftware.net
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Příspěvekod Tralalák » ned 24. zář 2017 15:29:15

ZX-D vs ZX-C vs ZX-A

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source: https://kknews.cc/tech/eabb8gn.html
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Příspěvekod Tralalák » pát 27. říj 2017 13:27:29

VIA Launches VIA SOM-9X20 Featuring Qualcomm® Snapdragon™­ 820 Embedded Platform


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Highly-integrated ultra-compact system-on-module accelerates development of next-generation Enterprise IoT and embedded devices

Taipei, Taiwan, 26 October, 2017 – VIA Technologies, Inc, today announced the launch of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm® Snapdragon™ 820 embedded platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

The VIA SOM-9X20 is an ultra-compact SoM that harnesses the leading-edge performance and low power consumption of the Snapdragon 820 embedded platform to provide a highly-flexible solution for enabling the rapid development of a variety of Enterprise IoT and embedded system applications ranging from human-machine interface (HMI), surveillance, and digital signage to robotics, cameras, and video conferencing.

“Combining cutting-edge computing, graphics, and video capabilities with advanced wireless connectivity and low power consumption, the Snapdragon 820 meets the exacting performance and power efficiency requirements of next-generation Enterprise IoT and embedded devices,” said Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc. “The VIA SOM-9X20 is designed to enable our customers to accelerate the development of groundbreaking new products with stunning 4K video capabilities for rapidly-emerging applications such as machine intelligence, computer vision, and Augmented and Virtual Reality.”

“The Snapdragon 820 embedded platform provides the performance, energy efficiency, and connectivity required in cutting-edge Enterprise IoT devices,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies, Inc. “We are delighted that VIA is making the power of Snapdragon available in an ultra-compact SoM that will help developers quickly create new and exciting commercial IoT systems, scenarios, and use cases.”

Snapdragon 820 processor

The Snapdragon 820 processor includes the following features:

Qualcomm® Kryo™ CPU: Designed to deliver maximum performance and low power consumption, Kryo is Qualcomm Technologies’ first custom 64-bit quad-core CPU, manufactured in advanced 14nm FinFET LPP process
Qualcomm® Adreno™ 530 GPU: Up to 40% better graphics and compute performance for improved visual fidelity while reducing power consumption than previous generations
Qualcomm Spectra™ 14-bit dual image signal processors (ISPs) engineered to deliver high resolution DSLR-quality images using heterogeneous compute for advanced processing and additional power savings, supports up to 28MP sensors with zero shutter lag
Qualcomm® Hexagon™ 680 DSP includes Hexagon Vector eXtensions (HVX) and Sensor Core with Low Power Island for constant sensor processing

VIA SOM-9X20

The VIA SOM-9X20 is a highly-integrated system-on-module powered by the Qualcomm Snapdragon 820 embedded platform. Measuring a mere 8.2cm x 4.5cm, the module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO.

The VIA SOM-9X20 module also provides a full set of advanced wireless connectivity features including GPS, BT 4.1, and Wi-Fi 802.11 a/b/g/n/ac through an integrated combo module featuring two antenna connectors. A multi-I/O evaluation carrier board is available to accelerate system development. Customers can also utilize VIA’s extensive technical support and design assistance services to develop a custom baseboard.

The VIA SOM-9X20 comes with a BSP that features Android 7.1.1 as well as the VIA Smart ETK (Embedded Tool Kit) comprising a number of APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, GPIO access, RTC for auto-power on, and a sample app.

A full set of hardware and software customization services that speed up time to commercialization and minimize development costs is available. A full turnkey development service can also be provided for interested customers.

For more information about the VIA SOM-9X20 please visit: https://www.viatech.com/en/boards/modules/som-9×20/

For images related to this release, please visit: https://www.viagallery.com/som-9×20/

source: www.viatech.com
"The VIA Nano processor was designed to bring power efficiency and performance to everyone, with no compromises"
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